Western Digital is hiring for the role of Development Engineering Intern 2022.
Opportunity details
Opportunity Type
Internship, Clerkship or Placement
Application dates
Minimum requirements
Accepting International Applications
No
Qualifications Accepted
E
Materials Engineering
Responsibilities
Conduct basic engineering research to support process improvement initiatives.
Understanding the Fundamentals of Lapping plate preparation.
Provide technical assistance to characterize the Lapping Plates.
Understanding / exploring a new method of fabricating lapping plates.
Qualifications
Undergraduate degree in BS Metallurgical Engineering or BS Materials Engineering.
Strong analytical, problem-solving skills and quick learner
Can work under minimal supervision.
Graduate Success Stories
Graduate stories
I am a Licensed Electronics Engineer and Electronics Technician from the University of Santo Tomas. I am a Fresh Graduate and currently working at Western Digital in Biñan, Laguna.